10043-35-3 | Boric Acid

Chemical type

• Metalloid compound
• Essential micronutrient

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• Weak acid, buffer agent

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Key properties

• Transported by NIPs (NIP II and NIP III groups) and XIPs
• Enhances plant tolerance to stress
• Permeability modulated by ar/R filter variations

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• Used in electroplating bath as pH buffer
• Stabilizes plating solution

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• Nutrient uptake in boron-deficient soils
• Improves salinity and drought tolerance
• Involved in cell wall stability and growth

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• Additive in copper electroplating solution

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Classification by use

• Solutes transported by AQPs for micronutrient homeostasis
• Chemicals enhancing abiotic stress resistance

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• Chemicals used in electroplating baths

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A trustworthy factory and manufacturer

Demei Chemical Technology Co., Ltd. is a modern high-tech enterprise integrating R&D, production, and sales. The company's founder, Dr. Arron, born in April 1975, graduated from the School of Mechanical Engineering at Yanshan University and has been engaged in research in the fields of mechanical engineering and chemical synthesis for many years. The company's products focus on the chemical industry, primarily dealing in chemical raw materials and chemical production machinery and equipment. With its strong technical capabilities, advanced production equipment, and strict quality management system, the company has earned the trust of customers worldwide.

1. [Cite:1] Systematic Review of Plant AQPs: Molecular mechanisms, intracellular trafficking, and emerging roles in stress adaptation, Current Plant Biology, Volume 45, January 2026, 100586
2. [Cite:2] A novel electrochemical deposition of copper conductor on flexible printed circuit boards, Electrochemistry Communications, Volume 183, February 2026, 108090