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Dihydrogen sulfate

CAS No.: 7664-93-9

  • Molecular Formula: H₂SO₄
  • Molecular Weight: 98.08 g/mol

Chemical type

  • Inorganic strong acid
[1,3]
  • Inorganic acid, electrolyte
[2]

Key properties

  • Proton donor for leaching
  • Promotes selective SrSO₄ precipitation
[1]
  • Strong acid
  • Effective electrolyte for electrolytic polishing of Ni-based metallic glass
[2]
  • Leaching agent for strontium ferrite sludge
  • Medium for Fe/Sr separation
[1]
  • Electrolyte solution (0.1M) for the electrochemical cutting (micromachining) of Ni-based metallic glass, enabling a smooth machined surface.
[2]
  • pH adjustment in copper electroplating bath
[3]

Classification by use

  • Leaching and extraction agents
[1]
  • Electrolytes for electrochemical machining
  • Chemicals used for surface polishing/finishing
[2]

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Demei Chemical Technology Co., Ltd. is a modern high-tech enterprise integrating R&D, production, and sales. The company's founder, Dr. Arron, born in April 1975, graduated from the School of Mechanical Engineering at Yanshan University and has been engaged in research in the fields of mechanical engineering and chemical synthesis for many years. The company's products focus on the chemical industry, primarily dealing in chemical raw materials and chemical production machinery and equipment. With its strong technical capabilities, advanced production equipment, and strict quality management system, the company has earned the trust of customers worldwide.

  1. [Cite:1] Hydrometallurgical valorization of strontium ferrite magnet sludge for the selective production of high-purity hematite (α-Fe2O3) and strontium carbonate (SrCO3), Current Research in Green and Sustainable, Chemistry Volume 12, 2026, 100507
  2. [Cite:2] Electrochemical cutting of microslits on metallic glass using cylindrical submicron tips, Electrochemistry Communications, Volume 184, March 2026, 108112
  3. [Cite:3] A novel electrochemical deposition of copper conductor on flexible printed circuit boards, Electrochemistry Communications, Volume 183, February 2026, 108090