Cupric sulfate anhydrous
CAS No.: 7758-98-7
- Molecular Formula: CuSO₄
- Molecular Weight: 159.61 g/mol
Chemical type
- Inorganic salt, source of Cu²⁺ ions
Key properties
- Source of copper ions for displacement and electroplating reactions
- Can be added in powder form to aluminum paste
- Dissociates in solution to provide Cu²⁺ ions
- Displacement solution for converting aluminum to copper seed layer
- Additive in aluminum paste to provide internal copper ion source
- Electroplating electrolyte component
Classification by use
- Chemicals used in electroplating and electrochemical deposition
- Chemicals used in conductive ink and paste formulations
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- A novel electrochemical deposition of copper conductor on flexible printed circuit boards, Electrochemistry Communications, Volume 183, February 2026, 108090
